Impact of SF6 Plasma on DC and Microwave Performance of AIGaN/GaN HEMT Structures

G. Vanko, T. Lalinsky, M. Tomáška, S. Hascik, Z. Mozolova, J. Škriniarová, I. Kostic, A. Vincze, F. Uherek
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引用次数: 1

Abstract

The improved dc and microwave properties of 2 mum gate length AlGaN/GaN based HEMT structures were observed after applying of a novel approach in the forming of the Schottky gate interface. The new approach uses a shallow recess-gate plasma etching of AlGaN barrier layer in combination with "in-situ" SF6 surface plasma treatment under Schottky gate. A significant improvement in both the current gain cut-off frequency (ft) and maximum oscillation frequency (fmax) were demonstrated. The exact mechanism to explain the improved performance of the SF6 plasma treated HEMTs is in progress. A great potential of the approach for sub-micrometer gate length technology of HEMTs is also emphasized.
SF6等离子体对AIGaN/GaN HEMT结构直流和微波性能的影响
采用一种新的方法形成肖特基栅界面后,观察到2 mum栅极长度AlGaN/GaN基HEMT结构的直流和微波性能得到改善。新方法采用浅层凹栅等离子体蚀刻AlGaN势垒层,结合Schottky栅极下的原位SF6表面等离子体处理。在电流增益截止频率(ft)和最大振荡频率(fmax)方面都有显著的改进。SF6等离子体处理的hemt性能改善的确切机制尚在研究中。强调了亚微米栅极长度hemt技术的巨大潜力。
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