G. Vanko, T. Lalinsky, M. Tomáška, S. Hascik, Z. Mozolova, J. Škriniarová, I. Kostic, A. Vincze, F. Uherek
{"title":"Impact of SF6 Plasma on DC and Microwave Performance of AIGaN/GaN HEMT Structures","authors":"G. Vanko, T. Lalinsky, M. Tomáška, S. Hascik, Z. Mozolova, J. Škriniarová, I. Kostic, A. Vincze, F. Uherek","doi":"10.1109/ASDAM.2008.4743352","DOIUrl":null,"url":null,"abstract":"The improved dc and microwave properties of 2 mum gate length AlGaN/GaN based HEMT structures were observed after applying of a novel approach in the forming of the Schottky gate interface. The new approach uses a shallow recess-gate plasma etching of AlGaN barrier layer in combination with \"in-situ\" SF6 surface plasma treatment under Schottky gate. A significant improvement in both the current gain cut-off frequency (ft) and maximum oscillation frequency (fmax) were demonstrated. The exact mechanism to explain the improved performance of the SF6 plasma treated HEMTs is in progress. A great potential of the approach for sub-micrometer gate length technology of HEMTs is also emphasized.","PeriodicalId":306699,"journal":{"name":"2008 International Conference on Advanced Semiconductor Devices and Microsystems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Advanced Semiconductor Devices and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2008.4743352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The improved dc and microwave properties of 2 mum gate length AlGaN/GaN based HEMT structures were observed after applying of a novel approach in the forming of the Schottky gate interface. The new approach uses a shallow recess-gate plasma etching of AlGaN barrier layer in combination with "in-situ" SF6 surface plasma treatment under Schottky gate. A significant improvement in both the current gain cut-off frequency (ft) and maximum oscillation frequency (fmax) were demonstrated. The exact mechanism to explain the improved performance of the SF6 plasma treated HEMTs is in progress. A great potential of the approach for sub-micrometer gate length technology of HEMTs is also emphasized.