Preparation and properties of micro-hotplates for gas sensors based on GaAs

D. Tengeri, A. Pullmannova, I. Hotovy, V. Rehacek, S. Hascik, T. Lalinsky
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引用次数: 2

Abstract

In this work, analysis of three different heating systems for two types of Pt micro-hotplate is reported: GaAs bulk structure (bulk GaAs), polyimide/GaAs bulk structure (PI-GaAs) and AlGaAs/GaAs suspended membrane structure (AlGaAs/GaAs). Complex electro-thermal characterization of prepared micro-hotplates was realized. Maximal reachable temperature of suspended membrane heating structure was 260degC with corresponding power 36 mW compared with the GaAs bulk structure with maximal temperature 220degC and corresponding power 1.5 W. At temperatures and powers above maximal limits, degradation and destruction of heating meanders occurred. Power consumption P200degC of sample on GaAs bulk substrate was 850 mW, and on PI/GaAs bulk substrate 380 mW, whereas power consumption of sample prepared on AlGaAs/GaAs suspended membrane was significantly lower about 26 mW.
GaAs气体传感器微热板的制备及性能研究
本文分析了两种类型Pt微热板的三种不同加热系统:GaAs体结构(bulk GaAs)、聚酰亚胺/GaAs体结构(PI-GaAs)和AlGaAs/GaAs悬浮膜结构(AlGaAs/GaAs)。对制备的微热板进行了复杂的电热表征。悬膜加热结构的最高可达温度为260℃,对应功率为36 mW,而GaAs体结构的最高可达温度为220℃,对应功率为1.5 W。当温度和功率超过最大极限时,加热弯曲会发生降解和破坏。在GaAs大块衬底上制备样品的P200degC功耗为850 mW,在PI/GaAs大块衬底上制备样品的P200degC功耗为380 mW,而在AlGaAs/GaAs悬浮膜上制备样品的功耗约为26 mW。
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