Performance analysis of multi-VT design solutions in 28nm UTBB FD-SOI technology

B. Pelloux-Prayer, Milovan Blagojevic, S. Haendler, A. Valentian, A. Amara, P. Flatresse
{"title":"Performance analysis of multi-VT design solutions in 28nm UTBB FD-SOI technology","authors":"B. Pelloux-Prayer, Milovan Blagojevic, S. Haendler, A. Valentian, A. Amara, P. Flatresse","doi":"10.1109/S3S.2013.6716548","DOIUrl":null,"url":null,"abstract":"UTBB FD-SOI technology is able to reach very high speeds thanks to flip-Wells variant which enables low-VT (LVT) tuning. This approach appears to be the best design option to catch high CPU frequencies or/and optimal energy consumption. To save power when logical paths are not critical, regular-VT (RVT) transistors, which seat on classical-Wells, cannot be abutted to LVT transistors because of the Well bias conflicts. To overcome these multi-VT constraints, several innovative cointegration schemes based on single-Well (SW) approaches have been designed in 28nm UTBB FD-SOI technology and validated by silicon results.","PeriodicalId":219932,"journal":{"name":"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/S3S.2013.6716548","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19

Abstract

UTBB FD-SOI technology is able to reach very high speeds thanks to flip-Wells variant which enables low-VT (LVT) tuning. This approach appears to be the best design option to catch high CPU frequencies or/and optimal energy consumption. To save power when logical paths are not critical, regular-VT (RVT) transistors, which seat on classical-Wells, cannot be abutted to LVT transistors because of the Well bias conflicts. To overcome these multi-VT constraints, several innovative cointegration schemes based on single-Well (SW) approaches have been designed in 28nm UTBB FD-SOI technology and validated by silicon results.
基于28nm UTBB FD-SOI技术的多vt设计方案性能分析
UTBB FD-SOI技术能够达到非常高的速度,这要归功于翻转井的变体,它可以实现低vt (LVT)调谐。这种方法似乎是捕获高CPU频率或/和最佳能耗的最佳设计选项。为了在逻辑路径不重要的情况下节省功耗,传统井上的常规vt (RVT)晶体管由于井偏置冲突而无法与LVT晶体管相邻。为了克服这些多vt限制,在28nm UTBB FD-SOI技术上设计了几种基于单井(SW)方法的创新协整方案,并通过硅结果进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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