Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs

Heechun Park, B. W. Ku, Kyungwook Chang, D. Shim, S. Lim
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引用次数: 14

Abstract

Despite the recent academic efforts to develop Electronic Design Automation (EDA) algorithms for 3D ICs, the current market does not have commercial 3D computer-aided design (CAD) tools. Insteadpseudo-3D alternative design flows have been devised which utilize commercial 2D CAD engines with tricks that help them operate as a fairly-efficient 3D CAD tool. In this paper we provide detailed discussions and fair power-performance-area (PPA) comparisons of state-of-the-art pseudo-3D design flows. We also analyze the limitations of each design flow and provide solutions with better PPA and various design options. Our experiments using commercial PDK, GDS layouts, and sign-off simulations demonstrate that we achieve up to 26% wirelength and 10% power consumption reduction for pseudo-3D design flows. We also provide a partitioning-first scheme to partitioning-last design flow which increases design freedom with tolerable PPA degradation.
针对单片3D集成电路的商业级rtl到gds工具流的伪3D方法
尽管最近学术界努力为3D集成电路开发电子设计自动化(EDA)算法,但目前市场上还没有商用的3D计算机辅助设计(CAD)工具。相反,伪3D替代设计流已经被设计出来,它利用商业2D CAD引擎的技巧,帮助它们作为一个相当高效的3D CAD工具运行。在本文中,我们提供了最先进的伪三维设计流程的详细讨论和公平的功率-性能面积(PPA)比较。我们还分析了每个设计流程的局限性,并提供了更好的PPA和各种设计选项的解决方案。我们使用商业PDK, GDS布局和签名模拟进行的实验表明,我们在伪3d设计流程中实现了高达26%的带宽和10%的功耗降低。我们还提供了一个分区优先的方案到分区最后的设计流程,在可容忍的PPA退化的情况下增加了设计自由度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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