A 14 nm SoC platform technology featuring 2nd generation Tri-Gate transistors, 70 nm gate pitch, 52 nm metal pitch, and 0.0499 um2 SRAM cells, optimized for low power, high performance and high density SoC products

C. Jan, F. Al-amoody, H. Chang, T. Chang, Y. Chen, N. Dias, W. Hafez, D. Ingerly, M. Jang, E. Karl, S. Shi, K. Komeyli, H. Kilambi, A. Kumar, K. Byon, C. Lee, J. Lee, T. Leo, P. Liu, N. Nidhi, R. Olac-vaw, C. Petersburg, K. Phoa, C. Prasad, C. Quincy, R. Ramaswamy, T. Rana, L. Rockford, A. Subramaniam, C. Tsai, P. Vandervoorn, L. Yang, A. Zainuddin, P. Bai
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引用次数: 1

Abstract

A leading edge 14 nm SoC platform technology based upon the 2nd generation Tri-Gate transistor technology [5] has been optimized for density, low power and wide dynamic range. 70 nm gate pitch, 52 nm metal pitch and 0.0499 um2 HDC SRAM cells are the most aggressive design rules reported for 14/16 nm node SoC process to achieve Moore's Law 2x density scaling over 22 nm node. High performance NMOS/PMOS drive currents of 1.3/1.2 mA/um, respectively, have been achieved at 0.7 V and 100 nA/um off-state leakage, 37%/50% improvement over 22 nm node. Ultra-low power NMOS/PMOS drives are 0.50/0.32 mA/um at 0.7 V and 15pA/um Ioff. This technology also deploys high voltage I/O transistors to support up to 3.3 V I/O. A full suite of analog, mixed-signal and RF features are also supported.
14纳米SoC平台技术,采用第二代三栅极晶体管、70纳米栅极间距、52纳米金属间距和0.0499 um2 SRAM单元,针对低功耗、高性能和高密度SoC产品进行了优化
基于第二代三栅极晶体管技术[5]的领先14纳米SoC平台技术已针对密度、低功耗和宽动态范围进行了优化。70 nm栅极间距,52 nm金属间距和0.0499 um2 HDC SRAM单元是14/16 nm节点SoC工艺中最激进的设计规则,以实现摩尔定律2x密度在22 nm节点上的缩放。在0.7 V和100 nA/um下,NMOS/PMOS驱动电流分别达到了1.3/1.2 mA/um,比22 nm节点提高了37%/50%。超低功耗NMOS/PMOS驱动器在0.7 V和15pA/um下为0.50/0.32 mA/um。该技术还部署了高压I/O晶体管,以支持高达3.3 V的I/O。还支持全套模拟,混合信号和RF功能。
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