A Vacuum Multi-Finger Transistor in CMOS Technology

S. Ghotbi, H. Pajouhi, S. Mohammadi
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Abstract

Electron filed emission is the process of emission of electrons from a conductor into the vacuum by means of an applied electric field and has a wide range of applications such as displays, electron guns, scanning electron microscopes, high power microwave amplifiers and micro- and nano-vacuum tubes. Vacuum electronic technology became obsolete by its poor reliability characteristics compared to semiconductor technologies. On the other hand, electrons in vacuum can accelerate to close to the speed of light, leading to potentially ultra-high speed devices if the gap between the emitting electrode (Cathode) and an opposing electrode (Anode) is very small (nanometer scale). In such nano-vacuum transistors [1]–[3], fabrication simplicity and reproducibility, high current density, good reliability characteristics and low cost fabrication are of prime importance. In this paper, a high density array of metallic nano-emitters are designed in a standard 45 nm CMOS technology, and are then post-processed using a simple one-step dry etching technology. No lithography is used in the post-CMOS fabrication. Field emission characteristics of the vacuum transistors have been measured. These devices show well-behaved transistor characteristics and are very promising for low-power high-speed applications.
CMOS技术中的真空多指晶体管
电子场发射是利用外加电场将电子从导体发射到真空中的过程,在显示器、电子枪、扫描电子显微镜、高功率微波放大器和微纳米真空管等方面有着广泛的应用。与半导体技术相比,真空电子技术由于可靠性差而过时。另一方面,真空中的电子可以加速到接近光速,如果发射电极(阴极)和相反电极(阳极)之间的间隙非常小(纳米级),则可能导致超高速器件。在这种纳米真空晶体管[1]-[3]中,最重要的是制造简单和可重复性、高电流密度、良好的可靠性和低制造成本。本文采用标准的45纳米CMOS技术设计了高密度的金属纳米发射器阵列,然后使用简单的一步干蚀刻技术进行后处理。在后cmos制造中不使用光刻技术。测量了真空晶体管的场发射特性。这些器件表现出良好的晶体管特性,非常有希望用于低功耗高速应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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