Model for nano-scale bonding wires under thermal loading

Abstract

In a companion paper, we studied the behavior of thick bonding wires under thermal loading and found good wire performance at elevated temperatures. This study extends the previous work to explore analyitcally the static stability of nano-scale bonding wires under thermal loading. Eringen nonlocal model is used to introduce nano-scale effects into Euler-Bernoulli beam theory, which is then employed to describe the wire response. Critical buckling loads and the amplitude of the static post-buckling nonlinear response are obtained. Numerical results show that taking the nano-scale effects into account leads to lower estimates of wire stiffness and buckling loads.