Impact of a Crack on Heat Flux in a Solder Joint between an Electronic Component Pin and a Printed Circuit Board

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI:10.1109/THERMINIC52472.2021.9626521

A. Kozlov

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Abstract

The paper discusses the thermal processes in a cracked solder joint between a component pin and a printed circuit board. For modeling temperature distribution in the solder joint, the 2D analytical model is used. The structure of the solder joint is divided into eight rectangular regions one of which is the crack. For all regions, the stationary heat conduction equation and the corresponding boundary conditions are established. The solution of the heat equation for each region is carried out by the analytical method. Using these solutions, the temperature distribution in the solder joint with the crack is determined. Based on the analytical solution for the temperature distribution the expressions for the heat flux through the soldered joint with the crack and for the thermal resistance of this joint are obtained. This approach is used to determine the dependencies of the heat flux and the thermal resistance on the crack length for the following location of the crack in the solder joint: in the middle of the solder zone; under the electrical component; alongside the pad of the printed circuit board.

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裂纹对电子元件引脚与印刷电路板之间焊点热流的影响

本文讨论了元件引脚与印刷电路板之间的裂纹焊点的热过程。对于焊点温度分布的建模，采用二维解析模型。焊点的结构分为八个矩形区域，其中一个是裂纹。对于所有区域，建立了稳态热传导方程和相应的边界条件。用解析法求解了各区域的热方程。利用这些溶液，确定了含裂纹焊点的温度分布。在温度分布解析解的基础上，得到了含裂纹焊接接头的热流密度表达式和热阻表达式。该方法用于确定焊点中裂纹的以下位置的热流密度和热阻对裂纹长度的依赖关系:在焊点区域的中间;下电器元件;旁边是印刷电路板的衬垫。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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