Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

Abstract

The paper describes the integration of novel developed acoustic MEMS sensors, in an ultra-thin and flexible substrate for use in aerospace applications, such as wind tunnel test (WTT) and flight test (FT). The technology allows the fabrication of a large area array with flush mounted microphone sensors without any topography interfering with the flow. The final array contains more than 80 piezoresistive and piezoelectric MEMS sensors, at a dimension of 300×400 mm2. The thickness of the bare die array is 600 µm, the array with the packaged sensors below 1550 µm.