Suspended membrane inductors and capacitors for application in silicon MMIC's

Y. Sun, H. Van Zejl, J. Tauritz, R. Baets
{"title":"Suspended membrane inductors and capacitors for application in silicon MMIC's","authors":"Y. Sun, H. Van Zejl, J. Tauritz, R. Baets","doi":"10.1109/MCS.1996.506312","DOIUrl":null,"url":null,"abstract":"This paper considers the fabrication and modelling of suspended membrane inductors and capacitors on ordinary silicon substrates. A single post-processing etching step was added to an otherwise standard process. For both components, parasitic capacitances to ground are drastically reduced, enabling high frequency operation. Furthermore, the measured quality factor Q is demonstrably improved with respect to normally fabricated thin film components.","PeriodicalId":227834,"journal":{"name":"IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers","volume":"171 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"72","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1996.506312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 72

Abstract

This paper considers the fabrication and modelling of suspended membrane inductors and capacitors on ordinary silicon substrates. A single post-processing etching step was added to an otherwise standard process. For both components, parasitic capacitances to ground are drastically reduced, enabling high frequency operation. Furthermore, the measured quality factor Q is demonstrably improved with respect to normally fabricated thin film components.
应用于硅MMIC的悬浮膜电感和电容器
本文研究了普通硅衬底上悬浮膜电感和电容的制作和建模问题。一个单一的后处理蚀刻步骤被添加到一个标准的过程中。对于这两个组件,寄生电容对地大大减少,使高频工作。此外,相对于通常制造的薄膜元件,测量的质量因子Q得到了明显的改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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