Materials characterization, conduction development, and curing-effects on reliability of isotropically conductive adhesives

Abstract

Three commercially available, silver filled, snap cure isotropically electrically conductive adhesives for surface mount applications were selected for study. Fundamental material characterizations were conducted on these materials, including thermal analysis (DSC, TGA, and TMA), rheological, and dynamic mechanical analyses. Microstructural investigations (SEM, TEM, Auger) were performed to identify the silver flake size, distribution, and contact morphology. These analyses were related to the cure process and electrical conduction mechanisms of ICAs.