The Development of the Non-contact Electrical Leakage Property Measurement System for the High-K Dielectric Materials on DRAM Capacitors

Yusin Yang, Byung Sug Lee, Misung Lee, C. Jun, Tae Sung Kim
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Abstract

We have used the non-contact electrical property measurement system to characterize the electrical leakage property of high-K materials such as Al2O3 and HfO2 on a patterned wafer. The basic technology is to measure the surface voltage with micro Kelvin probe after the corona charge deposition on a measurement area. Because of the charge decay through a dielectric material, voltage-time spectra follow exponential time dependence that is the characteristic of leakage induced charge decay. We have measured the electrical leakage property of the storage capacitors on the direct cell area of DRAM device. The measured electrical leakage property can be classified according to the thickness of Al2O3 and HfO2. Since the electrical leakage property depends on a thickness of a dielectric material, voltage-time spectra show different shapes according to the HfO2 thickness. Using the technology, we can monitor the electrical leakage property of the storage capacitors of high-K materials on the direct cell area
DRAM电容器高k介电材料非接触漏电性能测量系统的研制
我们使用非接触式电性能测量系统来表征高k材料(如Al2O3和HfO2)在图案晶圆上的漏电特性。其基本技术是在测量区域沉积电晕电荷后,用微开尔文探针测量表面电压。由于电荷通过介电材料衰减,电压-时间谱遵循指数时间依赖性,这是泄漏诱导电荷衰减的特征。在DRAM器件的直接单元面积上测量了存储电容的漏电特性。测得的漏电性能可根据Al2O3和HfO2的厚度进行分类。由于漏电特性与介质材料的厚度有关,因此电压-时间谱根据HfO2的厚度呈现出不同的形状。利用该技术,可以对高k材料的存储电容器在直接电池区域的漏电特性进行监测
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