Fault-tolerant designs for 256 Mb DRAM

T. Kirihata, Y. Watanabe, H. Wong, J. DeBrosse, M. Yoshida, D. Kato, S. Fujii, M. Wordeman, P. Poechmueller, Stephen A. Parke, Y. Asao
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引用次数: 36

Abstract

Conventional redundancy architecture employs a repair region in each block, and therefore has disadvantages: (1) each block must have at least one (preferably two) redundant row and column, increasing design space; (2) grouped or clustered fails are difficult to repair; (3) a cross fail (WL/BL short-circuit) increases the stand-by current, causing a standby fail. Fault-tolerant designs were developed for a 256 Mb DRAM to overcome these problems by means of a redundancy block, interchangeable Master DQ's (MDQ's), and a current limiter.
256 Mb DRAM的容错设计
传统的冗余架构在每个块中使用一个修复区域,因此存在以下缺点:(1)每个块必须至少有一个(最好是两个)冗余行和列,增加了设计空间;(2)分组或集群故障难以修复;(3)交叉故障(WL/BL短路)增加待机电流,导致待机故障。通过冗余块、可互换的主DQ (MDQ)和电流限制器,为256 Mb DRAM开发了容错设计来克服这些问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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