Charging effects on SOI based NEMS by the example of a nanoscale Thermal-Time-of-Flight (TToF) sensor

S. Ebschke, M. Wieker, J. Gerwinn, A. Loechte, K. Kallis, H. Fiedler
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引用次数: 1

Abstract

By the use of novel techniques like Silicon-on-insulator (SOI) wafer and electron beam lithography (EBL), the development of new types of NEMS-sensors, like a nanoscale Thermal-Time-of-Flight (TToF) sensor, are possible. While scaling the dimensions to a nanoscale level, new side effects will become non neglectable. Within the research and development of a nanoscale TToF sensor such a side effect has been discovered. It shows that the charging of the buried oxide, while applying a voltage to the nano diodes, has an important impact on the characteristics of this kind of sensor. The significance of this effect and its impact on this type of sensor and similar sensors will be shown within this paper.
以纳米级热飞行时间(TToF)传感器为例,研究了SOI基NEMS的充电效应
通过使用绝缘体上硅(SOI)晶圆和电子束光刻(EBL)等新技术,开发新型nems传感器(如纳米级热飞行时间(TToF)传感器)成为可能。当将尺寸缩放到纳米级时,新的副作用将变得不可忽视。在纳米级TToF传感器的研究和开发过程中,已经发现了这种副作用。结果表明,埋地氧化物的充电,同时对纳米二极管施加电压,对这种传感器的特性有重要影响。这种效应的意义及其对这种类型的传感器和类似传感器的影响将在本文中显示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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