A statistical method to integrate manufacturing tolerance in high-speed digital circuit design

N. Goel, K. Kalaichelvan, B. Bleuer
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Abstract

The authors outline a computationally efficient statistical method to design high-speed digital circuits, taking into account the manufacturing tolerance of interconnects. The proposed method can be used in the design of high-density printed circuit packs and multi-chip modules (MCMs). It can also be used to bring the aspects of manufacturability into the early stage of the design to minimize the cycle time between design and the final product. The design process presented here uses Monte Carlo analysis along with stochastic approximation to optimize the cost per satisfactory circuit. A relationship is established between the electrical requirements and the manufacturing tolerance of interconnects. Manufacturability signature profiles are presented for various interconnect configurations such as microstrip and buried microstrip. Finally, the simulation results are verified experimentally for the design of MCMs and are found to be in good agreement.<>
高速数字电路设计中集成制造公差的统计方法
作者概述了一种计算效率高的统计方法来设计高速数字电路,同时考虑到互连的制造公差。该方法可用于高密度印刷电路封装和多芯片模块的设计。它还可以用于将可制造性方面引入设计的早期阶段,以最大限度地缩短设计和最终产品之间的周期时间。本文介绍的设计过程使用蒙特卡罗分析和随机逼近来优化每个满意电路的成本。建立了电气要求与互连的制造公差之间的关系。提出了微带和埋入式微带等不同互连结构的可制造性特征曲线。最后,通过实验验证了仿真结果与mcm设计的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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