RF SiP technology innovation through integration

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298786

Jianhua Wu, M. J. Anderson, D. Coller, G. Guth

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引用次数: 8

Abstract

System-in-package (SiP) products have been growing rapidly in recent years as an alternative to system-on-chip (SoC) products. As a packaging technology platform, SiP allows a high degree of flexibility in package architecture, particularly for RF applications. RF SiP is a powerful packaging platform for wireless communication and data access and enables the integration of digital ICs, logic ICs and RFICs into a compact RF system or sub-system within a single module format using state-of-the-art technology converged from IC packaging and SMT assembly. In this paper, the trends of wireless access and mobile networking technologies are reviewed. Technical challenges and constraints to wireless systems for handset and mobile access appliances are discussed. The packaging technology choice, performance and cost trade-offs are presented using RF SiP as a packaging platform. Finally, a novel SiP scenario is presented, which aims to provide an innovative solution through integration to help meet the demands of miniaturization, performance and cost for wireless handset and other mobile products.

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通过集成创新射频SiP技术

近年来，作为片上系统(SoC)产品的替代品，系统级封装(SiP)产品发展迅速。作为一个封装技术平台，SiP在封装架构方面具有高度的灵活性，特别是在射频应用方面。RF SiP是一个功能强大的封装平台，用于无线通信和数据访问，可以将数字IC，逻辑IC和rfic集成到一个紧凑的RF系统或子系统中，采用最先进的技术，融合了IC封装和SMT组装。本文综述了无线接入和移动网络技术的发展趋势。讨论了手机和移动接入设备无线系统的技术挑战和限制。介绍了使用射频SiP作为封装平台的封装技术选择、性能和成本权衡。最后，提出了一种新的SiP场景，旨在通过集成提供一种创新的解决方案，以帮助满足无线手机和其他移动产品的小型化、性能和成本需求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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