Sub-100 nm regrown S/D Gate-Last In0.7Ga0.3As QW MOSFETs with μn,eff > 5,500 cm2/V-s

C. Shin, W. Park, S. Shin, Y. D. Cho, D. Ko, T. Kim, D. Koh, H. Kwon, R. Hill, P. Kirsch, W. Maszara, D. Kim
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引用次数: 7

Abstract

This paper reports on gate-last (GL) In0.7Ga0.3As QW MOSFETs with regrown S/D by MOCVD. Long-channel devices exhibit excellent electrostatics and carrier transport (SS=80mV/dec., DIBL=22mV/V, and μn,eff>5,500 cm2/V-s at 300k). Short-channel device with Lg = 40 nm also exhibit excellent electrostatic integrity of SS = 105 mV/dec., and DIBL = 150 mV/V, together with gm_max = 2 mS/μm at VDS = 0.5 V. This record performance is achieved by using a low Dit and Al2O3/HfO2 gate stack with EOT ~ 1-nm, optimized selective S/D regrowth with MOCVD, and GL process.
Sub-100 nm再生S/D栅极- last In0.7Ga0.3As QW mosfet, μn,eff > 5,500 cm2/V-s
本文报道了用MOCVD法再生S/D的栅末(GL) In0.7Ga0.3As QW mosfet。长通道器件具有优异的静电性能和载流子输运(SS=80mV/dec)。在300k时,DIBL=22mV/V, μn = 5,500 cm2/V-s)。Lg = 40 nm的短通道器件也表现出SS = 105 mV/dec的良好静电完整性。, DIBL = 150 mV/V, VDS = 0.5 V时gm_max = 2 mS/μm。这一创纪录的性能是通过使用EOT ~ 1 nm的低Dit和Al2O3/HfO2栅极堆栈、优化的MOCVD选择性S/D再生和GL工艺实现的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
3.40
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