Progress in Silicon Carbide Power Devices

A. Agarwal, M. Das, B. Hull, S. Krishnaswami, J. Palmour, J. Richmond, S. Ryu, J. Zhang
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引用次数: 36

Abstract

SiC materials and device technology has entered a new era with the commercialization and acceptance of 600 V/10 A and 1200 V/10 A Schottky Barrier Diodes (SBDs) in the marketplace. These diodes are finding applications in the Power Factor Correction (PFC) stage of Switch Mode Power Supplies (SMPS). SiC power MOSFETs with ratings of 800-1200 V up to 10 A will soon be commercially available. The next step is to integrate the SiC MOSFET and Schottky diodes in a power module for PFC and motor control applications. For high temperature applications, greater than 200°C, a bipolar switch such as a SiC BJT offers superior performance over the MOSFETs. The lack of gate oxide in the BJT offers better reliability at such extreme temperatures, in addition to the lowest combined switching and conduction losses.
碳化硅功率器件的进展
随着600 V/10 a和1200 V/10 a肖特基势垒二极管(sbd)在市场上的商业化和接受,SiC材料和器件技术进入了一个新时代。这些二极管在开关模式电源(SMPS)的功率因数校正(PFC)级中得到了应用。SiC功率mosfet的额定值为800-1200 V,最高可达10 A,将很快上市。下一步是将SiC MOSFET和肖特基二极管集成在功率模块中,用于PFC和电机控制应用。对于大于200°C的高温应用,双极开关(如SiC BJT)提供比mosfet更优越的性能。除了具有最低的开关和传导综合损耗外,BJT中栅极氧化物的缺乏还提供了在这种极端温度下更好的可靠性。
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