Ultraviolet Laser Photoablation of Polymers: A Review and Recent Results

Laser Chemistry Pub Date : 1900-01-01 DOI:10.1155/1989/18750
S. Lazare, V. Granier
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引用次数: 167

Abstract

The evolution since 1982, of far-UV laser photoablation of polymers is described. The experimental data can be fitted by using a dynamic model which states that the irradiated interface moves at a rate proportional to the difference between, the intensity reaching it, and the ablation threshold intensity It. The screening effect of the ablated gaseous products is taken into account. The experimental etch depth versus fluence, obtained with our new quartz crystal microbalance technique, can be fitted by adjusting two parameters of this model; the mean absorption coefficient of the products β and the so-called ablation rate constant k, which is the etch rate for I=It
聚合物的紫外激光光烧蚀研究进展及最新成果
介绍了自1982年以来,远紫外激光光烧蚀聚合物技术的发展。实验数据可以用一个动态模型拟合,该模型表明辐照界面的移动速度与到达界面的强度与烧蚀阈值强度之差成正比。考虑了烧蚀气体产物的筛选效果。通过调整该模型的两个参数,可以拟合石英晶体微天平技术得到的实验蚀刻深度与通量的关系;产物的平均吸收系数β和所谓的烧蚀速率常数k,即I=It时的蚀刻速率
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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