Ground plane influence on zero-temperature-coefficient in SOI UTBB MOSFETs with different silicon film thicknesses

C. Macambira, V. Itocazu, L. Almeida, J. Martino, E. Simoen, C. Claeys
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引用次数: 4

Abstract

This paper presents an analysis of the Ground Plane (GP) influence on the Zero Temperature Coefficient (ZTC) in Ultra Thin Body and Buried Oxide (UTBB) Silicon On Insulator (SOI) nMOS transistors for different silicon thicknesses (tSi) based on experimental data and analytical models. The presence of a GP increases the values of the bias voltage of ZTC (VZTC) due to the reduction of the substrate effects in the device and consequently the increase of threshold voltage. The VZTC shows to be inversely proportional to the silicon thickness. All results are confirmed by the analytical model for the threshold voltage, which is the predominant factor in the ZTC point for this technology, both showing the same tendency.
地平面对不同硅膜厚度SOI UTBB mosfet零温度系数的影响
基于实验数据和分析模型,分析了不同硅厚度(tSi)下,地平面(GP)对超薄体和埋藏氧化物(UTBB)绝缘子上硅(SOI) nMOS晶体管零温度系数(ZTC)的影响。GP的存在增加了ZTC (VZTC)的偏置电压值,这是由于器件中衬底效应的减少,从而增加了阈值电压。VZTC与硅厚度成反比。阈值电压作为该技术ZTC点的主导因素,其解析模型证实了上述结果,两者呈现出相同的趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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