Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices

Luke Yates, A. Sood, Zhe Cheng, Thomas L. Bougher, Kirkland D. Malcolm, Jungwan Cho, M. Asheghi, K. Goodson, M. Goorsky, F. Faili, D. Twitchen, S. Graham
{"title":"Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices","authors":"Luke Yates, A. Sood, Zhe Cheng, Thomas L. Bougher, Kirkland D. Malcolm, Jungwan Cho, M. Asheghi, K. Goodson, M. Goorsky, F. Faili, D. Twitchen, S. Graham","doi":"10.1109/CSICS.2016.7751032","DOIUrl":null,"url":null,"abstract":"Diamond films grown by chemical vapor deposition have the potential to improve the thermal management and reliability of AlGaN/GaN high electron mobility transistors. The integration of CVD diamond with GaN involves the nucleation and growth of diamond films on GaN which induces a vertical gradient in thermal conductivity of the diamond and can result in bulk properties that depend greatly on growth conditions. Thus accurate characterization of the thermal conductivity of CVD diamond, especially the lower conductivity near the growth interface is needed to assess the impact on AlGaN/GaN HEMTs. In this work, we present measurements of the thickness dependence of CVD diamond with thicknesses ranging from 5 to 13.8 μ m in addition to bulk diamond substrates using time domain thermoreflectance. Measurements were made on the same samples in two different laboratories which showed excellent correlation between the measurements. The diamond properties were then utilized in a thermal model of a 10 finger AlGaN/GaN HEMT to predict the impact of device junction temperature. Compared to a device made on SiC operating at 5 W/mm, a junction temperature reduction of 30-40% was seen when using CVD diamond and the same device size.","PeriodicalId":183218,"journal":{"name":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2016.7751032","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21

Abstract

Diamond films grown by chemical vapor deposition have the potential to improve the thermal management and reliability of AlGaN/GaN high electron mobility transistors. The integration of CVD diamond with GaN involves the nucleation and growth of diamond films on GaN which induces a vertical gradient in thermal conductivity of the diamond and can result in bulk properties that depend greatly on growth conditions. Thus accurate characterization of the thermal conductivity of CVD diamond, especially the lower conductivity near the growth interface is needed to assess the impact on AlGaN/GaN HEMTs. In this work, we present measurements of the thickness dependence of CVD diamond with thicknesses ranging from 5 to 13.8 μ m in addition to bulk diamond substrates using time domain thermoreflectance. Measurements were made on the same samples in two different laboratories which showed excellent correlation between the measurements. The diamond properties were then utilized in a thermal model of a 10 finger AlGaN/GaN HEMT to predict the impact of device junction temperature. Compared to a device made on SiC operating at 5 W/mm, a junction temperature reduction of 30-40% was seen when using CVD diamond and the same device size.
用于gan -on-金刚石器件的CVD金刚石导热性表征
化学气相沉积法生长的金刚石薄膜有可能改善AlGaN/GaN高电子迁移率晶体管的热管理和可靠性。CVD金刚石与氮化镓的集成涉及到金刚石薄膜在氮化镓上的成核和生长,这引起了金刚石导热系数的垂直梯度,并且可以产生很大程度上取决于生长条件的体性能。因此,需要准确表征CVD金刚石的导热系数,特别是生长界面附近的低导热系数,以评估对AlGaN/GaN hemt的影响。在这项工作中,我们提出了厚度范围从5到13.8 μ m的CVD金刚石的厚度依赖测量,以及使用时域热反射的大块金刚石衬底。在两个不同的实验室对相同的样品进行了测量,结果表明测量结果之间存在良好的相关性。然后在10指AlGaN/GaN HEMT的热模型中利用金刚石特性来预测器件结温的影响。与工作在5 W/mm SiC上的器件相比,使用CVD金刚石和相同器件尺寸时,结温降低了30-40%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信