Integrated Flex: Rigid-Flex Capability in a High Performance Mcm

Abstract

IBM Microelectronics has developed a High Performance Carrier (HPC) technology to provide leading edge packaging solutions to evolving computer system demands. High Performance Carrier provides high wireability, high performance, and high I/O capability at an affordable cost per unit function and performance. High Performance Carrier is an extremely versatile interconnection technology which is suitable for a broad range of applications. HPC utilizes a Teflon (R) based insulator material to provide superior electrical and mechanical characteristics, and a unique composite layer-joining process to enhance wireability, design flexibility, and composite yield. The High Performance Carrier technology can also provide integration of carrier, flex cables and connector into a single structure: cables are essentially the continuation of 'long' cores which extend beyond the laminated carrier region. This eliminates the need for mechanical or soldered interconnections at the cable-carrier interface. This design capability can significantly reduce interconnection distances and eliminate impedance discontinuities between the cable and carrier. I/O capability is drastically increased over conventional technologies: up to 300 I/O per linear inch per cable can be packaged. Cables can extend from any or all 4 edges of the carrier, providing a whole new realm of possibilities for interconnection of system packaging components, such as SCM's, MCM's, printed wiring boards, and switching networks. Three dimensional and folding third level packaging designs are also facilitated. This paper will give an overview of the HPC technology, and will discuss design, performance, reliability, and process aspects of Integrated Flex in detail.