{"title":"PWB thermal modeling computer tools at Texas Instruments","authors":"S. West, J. K. Pylant","doi":"10.1109/SEMTHE.1988.10609","DOIUrl":null,"url":null,"abstract":"Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed.<<ETX>>","PeriodicalId":162566,"journal":{"name":"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-02-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SEMTHE.1988.10609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed.<>