B. Smith, J. Xu, J. Devore, A. Chellamuthu, B. Amey, S. Pendharkar, T. Efland
{"title":"Peripheral motor drive PIC concerns for integrated LDMOS technologies","authors":"B. Smith, J. Xu, J. Devore, A. Chellamuthu, B. Amey, S. Pendharkar, T. Efland","doi":"10.1109/WCT.2004.239871","DOIUrl":null,"url":null,"abstract":"This work reviews common motor types, driving methods, and associated requirements of power LDMOS drivers including BVdss, Rdson, and SOA for peripheral product applications up to 60 V. Tradeoffs made between various processes, power efficiency, and circuit implementations are discussed. The paper explores additional motor driving specific concerns such as substrate injection, parasitic npn/pnp effects and robustness, reverse recovery, and ESD. Up integration concerns and sensitive circuit isolation techniques are also included. The introduction includes a short process technology outline for peripheral product power ICs (PICs).","PeriodicalId":303825,"journal":{"name":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCT.2004.239871","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
This work reviews common motor types, driving methods, and associated requirements of power LDMOS drivers including BVdss, Rdson, and SOA for peripheral product applications up to 60 V. Tradeoffs made between various processes, power efficiency, and circuit implementations are discussed. The paper explores additional motor driving specific concerns such as substrate injection, parasitic npn/pnp effects and robustness, reverse recovery, and ESD. Up integration concerns and sensitive circuit isolation techniques are also included. The introduction includes a short process technology outline for peripheral product power ICs (PICs).