Mixed mode 3D pseudo-1chip ESD surge simulation using hydrodynamic model for new LDMOS cell layout realizing super high ESD endurance over 25kV/mm2

K. Kohno, S. Takahashi, H. Himi, Y. Higuchi
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引用次数: 1

Abstract

For the first time, a new ESD surge simulation method that combines a 3D pseudo-1chip device model, consisting of an internal LDMOS cell and peripheral LDMOS cell, and a hydrodynamic physical model, is proposed in order to analyze the ESD destruction mechanism of LDMOS and optimize the cell layout against ESD. The simulation results show good agreement with experiments on ESD endurance and surge current crowding phenomena at the peripheral cell, causing poor ESD endurance. Utilizing the proposed simulation method, we developed a new LDMOS cell layout, achieving super high ESD endurance over 25 kV/mm/sup 2/.
利用流体动力学模型对新型LDMOS电池布局进行混合模式三维伪芯片ESD浪涌仿真,实现超过25kV/mm2的超高ESD续航能力
为了分析LDMOS的ESD破坏机理,优化电池的ESD布局,首次提出了一种新的ESD浪涌仿真方法,该方法结合了由内部LDMOS电池和外部LDMOS电池组成的三维伪芯片模型和流体动力学物理模型。仿真结果与实验结果吻合较好,外围电池出现浪涌电流拥挤现象,导致ESD耐久性较差。利用提出的仿真方法,我们开发了一种新的LDMOS电池布局,实现了超过25 kV/mm/sup /的超高ESD耐久性。
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