Single chip wireless systems using SOI

1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345) Pub Date : 1999-10-04 DOI:10.1109/SOI.1999.819833

R. Reedy, J. Cable, D. Kelly

引用次数: 14

Abstract

In this paper, we have demonstrated the product performance of critical elements of an integrated RFIC. Key requirements and advantages of SOI have been correlated. A highly integrated SOI RFIC with over 100 passive components was shown to have performance suitable for CDMA handsets. We have also shown that SOI can deliver advantageous products.

查看原文本刊更多论文

使用SOI的单芯片无线系统

在本文中，我们展示了集成RFIC的关键元件的产品性能。分析了SOI的关键要求和优势。具有100多个无源元件的高度集成SOI RFIC被证明具有适合CDMA手机的性能。我们也证明了SOI可以提供有利的产品。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)

自引率

0.00%

发文量