Influence of p-type MCT layer on junction formation during ion etching

P. Madejczyk, J. Rutkowski, W. Gawron, L. Kubiak, J. Wenus
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引用次数: 1

Abstract

The material used throughout this study was Mercury Cadmium Telluride (MCT) grown by liquid phase epitaxy (LPE). Due to its special physical and electrical properties, MCT is still one of the most important infrared materials. That's why we are looking for the ways of improving technology and processing and then extracting the best of this material. This article concerns the influence of p-type MCT layer on junction formation during ion etching. To achieve device quality p-type layers, a lot of experiments were performed with annealing of as-grown wafers or adding different quantity of As to the melt. The technological problems with activation of arsenic and with ion etching are shown. Adjusting of parameters of annealing and etching processes allows n-on-p junctions to be formed with a controllable electrical profile. Standard techniques were used to determine optical and electrical parameters of layers.
离子腐蚀过程中p型MCT层对结形成的影响
本研究使用的材料是通过液相外延(LPE)生长的碲化汞镉(MCT)。由于其特殊的物理和电学性能,MCT仍然是最重要的红外材料之一。这就是为什么我们正在寻找改进技术和加工的方法,然后提取最好的这种材料。本文研究了离子蚀刻过程中p型MCT层对结形成的影响。为了获得器件质量的p型层,对As晶圆进行了退火或在熔体中添加不同数量的As进行了大量的实验。指出了砷活化法和离子蚀刻法的工艺问题。调整退火和蚀刻工艺的参数可以使n-on-p结形成可控的电剖面。采用标准技术测定各层的光学和电学参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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