Interface passivation mechanisms in metal gated oxide capacitors

G. Lujan, T. Schram, G. Sjoblom, T. Witters, S. Kubicek, S. De Gendt, M. Heyns, K. De Meyer
{"title":"Interface passivation mechanisms in metal gated oxide capacitors","authors":"G. Lujan, T. Schram, G. Sjoblom, T. Witters, S. Kubicek, S. De Gendt, M. Heyns, K. De Meyer","doi":"10.1109/ESSDER.2004.1356555","DOIUrl":null,"url":null,"abstract":"We use the conductance technique to measure the density of interface states, D/sub it/, in MOS capacitors with metal gate electrodes. D/sub it/ as a function of the band gap is extracted for a series of capacitors. ALD TiN electrodes show poor passivation while PVD TaN electrodes do not. There is no evidence that the poor passivation in the TiN electrodes is because of low hydrogen diffusion through the metal oxide stack. Possibly, the strain induced by the ALD metal layer or contamination from the metal precursors are responsible for the poor passivation.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDER.2004.1356555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

We use the conductance technique to measure the density of interface states, D/sub it/, in MOS capacitors with metal gate electrodes. D/sub it/ as a function of the band gap is extracted for a series of capacitors. ALD TiN electrodes show poor passivation while PVD TaN electrodes do not. There is no evidence that the poor passivation in the TiN electrodes is because of low hydrogen diffusion through the metal oxide stack. Possibly, the strain induced by the ALD metal layer or contamination from the metal precursors are responsible for the poor passivation.
金属门控氧化物电容器的界面钝化机制
我们使用电导技术来测量具有金属栅电极的MOS电容器的界面态密度D/sub /。提取了一系列电容器带隙的D/sub /函数。ALD TiN电极表现出较差的钝化,而PVD TaN电极则没有。没有证据表明,TiN电极钝化不良是由于氢在金属氧化物堆中的低扩散造成的。可能是ALD金属层引起的应变或来自金属前体的污染导致钝化不良。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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