The Effect of Al and Pt/Ti Simultaneously Annealing on Electrical Characteristics of n-GaN Schottky Diode

T. Munir, A. Aziz, M. Abdullah
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引用次数: 1

Abstract

Wideband gap semiconductor GaN has received increasing attention for its potential for wide variety of high-power, high- performance switching and high-frequency devices application. In this paper the simultaneous annealing effect at a temperature of 400degC ~700degC in N2 ambient for 12 min on aluminum (1500 Adeg) as an ohmic contact while Pt/Ti (700 Adeg/700 Adeg) bilayer as a Schottky contact on the electrical characteristics of n- GaN Schottky diode was investigated. It was found that at a annealing temperature of 400degC produced the best (I-V) characteristics, barrier height (PhiB) 1.1 eV, ideality factor (eta) 1.1 as compared to the other annealing temperature. The (C-V) characteristics of n-GaN Schottky diode were measured at 100 kHz and 1 MHz frequency at different annealing temperature. It was found that at annealing temperature of 400degC, the depletion region is maximum with the capacitance value varied from 0.02 pF ~ 0.04 pF. At low frequency 100 kHz the capacitance increase with increasing forward voltage which is frequency independent, while at high frequency 1 MHz the capacitance- voltage curve is almost flat. The surface morphology of n-GaN Schottky diode before annealing and after annealing was observed by SEM, XRD. It was found that Al (1500 Adeg) didn't show any significant loss of dimensional stability at annealing temperature 400degC~700degC, while Pt/Ti (700 Adeg/700/Adeg) show balling effect, surface morphology degradation at above 400degC which was confirmed by XRD measurement. Hence we conclude that rectifying behavior of n-GaN Schottky diode was observed at annealing temperature 400deg C while annealing at above 400degC~700degC the rectifying characteristics of n-GaN Schottky diode changed to ohmic behavior due to Pt/Ti (700 Adeg/700 Adeg) island form of surface morphology occurred, while Al (1500 Adeg) as a ohmic contact show thermal stability at high temperature annealing above 400degC of n-GaN Schottky diode.
Al和Pt/Ti同时退火对n-GaN肖特基二极管电学特性的影响
宽带隙半导体GaN因其在大功率、高性能开关和高频器件中的广泛应用而受到越来越多的关注。本文研究了以铝(1500 Adeg)为欧姆触点,Pt/Ti (700 Adeg/700 Adeg)双分子层为肖特基触点,在400℃~700℃的N2环境中同时退火12 min对n- GaN肖特基二极管电特性的影响。结果发现,在400℃的退火温度下产生了最佳的(I-V)特性,势垒高度(PhiB)为1.1 eV,理想系数(eta)为1.1。在不同退火温度下,测量了n-GaN肖特基二极管在100 kHz和1 MHz频率下的(C-V)特性。结果表明,在400℃的退火温度下,电容值在0.02 ~ 0.04 pF之间变化最大,在100 kHz的低频下,电容随正向电压的增加而增加,且与频率无关,而在1 MHz的高频下,电容-电压曲线基本平坦。采用SEM、XRD等方法观察了n-GaN肖特基二极管退火前后的表面形貌。结果表明,Al (1500 Adeg)在400℃~700℃退火时尺寸稳定性没有明显下降,而Pt/Ti (700 Adeg/700/Adeg)在400℃以上退火时出现了球化现象,表面形貌发生了退化。因此,我们得出结论,n-GaN肖特基二极管在400℃退火时表现出整流行为,而在400℃~700℃退火时,由于Pt/Ti(700℃/700℃)的岛状表面形貌发生,n-GaN肖特基二极管的整流特性转变为欧姆行为,而Al(1500℃)作为欧姆触点在400℃以上高温退火时表现出热稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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