Low voltage SRAM design using tunneling regime of CNTFET

Z. Ahmed, K. Sarfraz, Lining Zhang, M. Chan
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引用次数: 2

Abstract

This paper presents low-voltage techniques for static random access memory (SRAM) bit-cell design using the ambipolar characteristics of Carbon Nanotube field effect transistor (CNTFET). The sub-60mV/dec band-to-band tunneling (BTBT) leakage region is used for transistor operation which reverses the charging-discharging characteristics of p-type and n-type CNTFETs compared to the conventional CMOS transistors. Our first 8T-SRAM design, operating at 0.33V power supply, has 6 p-type and 2 n-type CNTFETs, all operating in BTBT region. The second design uses all p-type CNTFETs for reliable fabrication process. The proposed SRAM bit-cells have 4 orders of magnitude lower standby leakage current, about 40% wider write margins and ~50% improved read static noise margins compared to state of the art 22nm CMOS bit-cell under an equal SRAM bit-cell area constraint.
利用CNTFET的隧道机制设计低压SRAM
本文介绍了利用碳纳米管场效应晶体管(CNTFET)的双极性特性设计静态随机存取存储器(SRAM)位单元的低压技术。在低于60mv /dec的带到带隧道(BTBT)漏区用于晶体管工作,与传统CMOS晶体管相比,p型和n型cntfet的充放电特性相反。我们的第一个8T-SRAM设计,在0.33V电源下工作,有6个p型和2个n型cntfet,都在BTBT区域工作。第二种设计采用全p型cntfet可靠的制造工艺。与同等SRAM位单元面积约束下的22nm CMOS位单元相比,所提出的SRAM位单元的待机泄漏电流降低了4个数量级,写入裕度提高了约40%,读取静态噪声裕度提高了约50%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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