Mechanical characteristics of 96.5 Sn/3.5 Ag solder in micro-bonding

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122236

M. Harada, R. Satoh

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引用次数: 64

Abstract

The influence of gold on the tensile properties and microstructure of 96.5 Sn/3.5 Ag solder and the thermal fatigue life of a 96.5 Sn/3.5 Ag-solder joint applied to a controlled-collapse chip joint was investigated and compared with the conventional solder, 63 Sn/37 Pb. A 96.5 Sn/3.5 Ag solder with several mass% of gold added is examined in terms of tensile properties and microstructure. Although 63 Sn/37 Pb with more than 3 mass% of gold has a poor ultimate elongation, 96.5 Sn/3.5 Ag extends well. Regarding the microstructure, intermetallic compounds alloyed by 96.5 Sn/3.5 Ag and gold are smaller than those of 63 Sn/37 Pb and gold. The influence of the thermal fatigue of microbonding is discussed. After the temperature cycling test, striations formed by the thermal fatigue are observed on the fractured surface. Their intervals are as fine as 0.04-0.2 mu m. The crack-propagation rate of the solder joint is calculated according to the alternating intervals of the striations. In this way, the life of each solder joint is estimated. The thermal fatigue life of 96.5 Sn/3.5 Ag solder is found to be about twice that of 63 Sn/37 Pb. The life estimated according to the striations is related to the strain calculated by the finite-element method (FEM) to obtain an experimental equation estimating the life of the controlled-collapse chip joint of 96.5 Sn/3.5 Ag. The 96.5 Sn/3.5 Ag solder is proven to have excellent characteristics for microbonding.<>

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96.5 Sn/3.5 Ag焊料微键合力学特性

研究了金对96.5 Sn/3.5 Ag焊料抗拉性能、显微组织及96.5 Sn/3.5 Ag焊点热疲劳寿命的影响，并与常规焊料63 Sn/37 Pb进行了比较。研究了96.5 Sn/3.5 Ag钎料的拉伸性能和显微组织。63 Sn/37 Pb在金质量%以上时的延伸率较差，而96.5 Sn/3.5 Ag的延伸率较好。显微结构方面，96.5 Sn/3.5 Ag与金合金的金属间化合物小于63 Sn/37 Pb与金合金的金属间化合物。讨论了微粘接热疲劳的影响。温度循环试验后，在断裂表面观察到热疲劳形成的条纹。它们的间隔可细至0.04 ~ 0.2 μ m，根据这些条纹的交替间隔计算焊点的裂纹扩展速率。这样，就可以估计每个焊点的寿命。96.5 Sn/3.5 Ag钎料的热疲劳寿命约为63 Sn/37 Pb钎料的2倍。根据条纹估算的寿命与有限元法计算的应变相关联，得到了96.5 Sn/3.5 Ag可控崩坏片式接头寿命的实验方程。96.5 Sn/3.5 Ag焊料具有优异的微键合性能

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量