Vertical Ga2O3 Schottky barrier diodes on single-crystal β-Ga2O3 (−201) substrates

B. Song, A. Verma, K. Nomoto, M. Zhu, D. Jena, H. Xing
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引用次数: 6

Abstract

Owing to the large bandgap, breakdown electric field (Eb) and high carrier mobility, wide-bandgap semiconductor (e.g. SiC and GaN) based power devices have been extensively studied for next-generation power-switching applications [1-2]. Recently, a new wide-bandgap oxide semiconductor, gallium oxide (β-Ga2O3), has attracted attention for power-switching applications because it has an extremely large bandgap of 4.5~4.9 eV enabling a high breakdown voltage (Vbr) and a high Baliga's figure of merit [3]. Furthermore, large-area and high-quality bulk substrates of Ga2O3 can be grown by low-cost methods, which remains a significant challenge for both SiC and GaN. Schottky barrier diodes (SBDs), with a low turn-on voltage and a fast switching speed due to majority carrier conduction, are ideal candidates for high-power and high-speed rectifiers. Recently, Higashiwaki et al. have demonstrated excellent device results, which includes SBDs with Vbr ~115 V on (010) Ga2O3 substrates (with a net doping concentration ND-NA ~ 5×1016 cm-3) [4] and SBDs with epitaxial Si-doped n-Ga2O3 drift layers (ND-NA ~ 1.4×1016 cm-3) grown by HVPE on (001) Ga2O3 substrates with Vbr ~ 500 V [5]. Oishi et al reported Ni-based SBDs on (-201) Ga2O3 with a Nd-Na ~ 1×1017 cm-3 and Vbr ~ 40 V [6]. However, no high voltage (Vbr > 100 V) devices have been reported yet on (-201) Ga2O3, the crystal orientation readily available in up to 4 inch diameter wafer. In this work, we report Pt-based SBDs fabricated on unintentionally-doped (UID) (-201) n-type Ga2O3 substrates with Vbr > 100 V.
单晶β-Ga2O3(−201)衬底上的垂直Ga2O3肖特基势垒二极管
由于大带隙、击穿电场(Eb)和高载流子迁移率,基于宽带隙半导体(如SiC和GaN)的功率器件已被广泛研究用于下一代功率开关应用[1-2]。近年来,一种新型的宽带隙氧化物半导体——氧化镓(β-Ga2O3),由于其具有4.5~4.9 eV的极大带隙,能够实现高击穿电压(Vbr)和高Baliga品质因数[3],在功率开关应用中引起了人们的关注。此外,大面积和高质量的Ga2O3基片可以通过低成本的方法生长,这对SiC和GaN来说仍然是一个重大挑战。肖特基势垒二极管(sbd)具有低导通电压和快速开关速度,由于大多数载流子传导,是高功率和高速整流器的理想候选者。最近,Higashiwaki等人展示了优异的器件成果,包括在(010)Ga2O3衬底(净掺杂浓度为ND-NA ~ 5×1016 cm-3)[4]上的Vbr ~115 V的sbd,以及在(001)Ga2O3衬底(Vbr ~ 500 V[5])上由HVPE生长的外延si掺杂n-Ga2O3漂移层(ND-NA ~ 1.4×1016 cm-3)的sbd。Oishi等报道了Nd-Na ~ 1×1017 cm-3和Vbr ~ 40 V[6]在(-201)Ga2O3上的ni基sdd。然而,目前还没有报道在(-201)Ga2O3上的高电压(Vbr > 100 V)器件,晶体取向容易在高达4英寸直径的晶圆上实现。在这项工作中,我们报道了在Vbr > 100 V的无意掺杂(UID) (-201) n型Ga2O3衬底上制备基于pt的sdd。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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