Electromigration enhanced growth of intermetallic compound in solder bumps

Abstract

Solder bumps are important interconnect components for three-dimensional (3D) integration. Their mechanical and electrical properties influence the overall reliability of 3D ICs. A particular characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation influences the operation of 3D ICs and, in connection with electromigration, may cause failures. We present a model for describing the growth of intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.