From SI, PI, EMI Design, Verification, to Package, Board, and Channel Intellectual Property

Abstract

The problems of signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) are always discovered in the high-speed digital system. Cost-effective channel designs, such as leadframe packages, low layer count boards, and the PCB with single-sided component placement (SSCP), are often adopted in the consumer electronics but undergo the significant SI, PI, or EMI issues. Some innovative designs were proposed to improve the cheap channels based on the concept of impedance control and ideal current return path. Those designs were also verified using chip-package-board co-simulation with chip netlists and channel S-parameters. Furthermore, those verified designs were classified into different types of intellectual property corresponding to the scopes of SI, PI, and EMI, and can be reused for next system designs without repeat of the same mistakes.