Electromigration Failure in Hieavily Doped Polycrystalline Silicon

M. Polcari, J. Lloyd, S. Cvikevich
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引用次数: 1

Abstract

Electromigration induced failures have been observed in both n & p doped polycrystalline silicon conductors. The location of the failure sites was found to depend upon the sign of the charge carrier. Migration of the dopant was identified as the failure mechanism.
重掺杂多晶硅的电迁移失效
在n和p掺杂多晶硅导体中都观察到电迁移引起的失效。发现故障地点的位置取决于电荷载体的标志。确定了掺杂剂的迁移是失效机制。
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