Application of Ag@Cu Water-Based Nanomaterial Conductive Ink in 3D Printing.

IF 2.3 4区工程技术 Q3 ENGINEERING, MANUFACTURING

3D Printing and Additive Manufacturing Pub Date : 2023-06-01 Epub Date: 2023-06-08 DOI:10.1089/3dp.2021.0199

Chenfei Zhao, Jun Wang, Zhuoqing Zhang, Bo Qian

{"title":"Application of Ag@Cu Water-Based Nanomaterial Conductive Ink in 3D Printing.","authors":"Chenfei Zhao, Jun Wang, Zhuoqing Zhang, Bo Qian","doi":"10.1089/3dp.2021.0199","DOIUrl":null,"url":null,"abstract":"<p><p>Copper (Cu) nanoparticles are considered a promising alternative to silver (Ag) and gold (Au) for printed electronics applications. Because Cu has higher electrical conductivity, it is significantly cheaper than Ag and Au. To study the applicability of electronic printing, we prepared Ag@Cu conductive ink by using a stepwise feeding method to disperse nano Ag and nano Cu in ethanol and water. The ink has the advantages of nontoxic, low content, and low cost. A three-dimensional (3D) model was designed, and a conductive pattern was printed on the photo paper substrate using extrusion 3D printing technology. The influence of waterborne resin on the adhesion of conductive patterns is discussed. The printed conductive pattern can maintain the stability of conductivity after 100 bending cycles. The conductive pattern has good thermal stability. It can be tested 10 times under 2 conditions of 85°C and room temperature to maintain good conductivity. This shows that Ag@Cu conductive ink printed flexible electronic products are competitive.</p>","PeriodicalId":54341,"journal":{"name":"3D Printing and Additive Manufacturing","volume":"10 3","pages":"552-558"},"PeriodicalIF":2.3000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10280186/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"3D Printing and Additive Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1089/3dp.2021.0199","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2023/6/8 0:00:00","PubModel":"Epub","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}

引用次数: 0

Abstract

Copper (Cu) nanoparticles are considered a promising alternative to silver (Ag) and gold (Au) for printed electronics applications. Because Cu has higher electrical conductivity, it is significantly cheaper than Ag and Au. To study the applicability of electronic printing, we prepared Ag@Cu conductive ink by using a stepwise feeding method to disperse nano Ag and nano Cu in ethanol and water. The ink has the advantages of nontoxic, low content, and low cost. A three-dimensional (3D) model was designed, and a conductive pattern was printed on the photo paper substrate using extrusion 3D printing technology. The influence of waterborne resin on the adhesion of conductive patterns is discussed. The printed conductive pattern can maintain the stability of conductivity after 100 bending cycles. The conductive pattern has good thermal stability. It can be tested 10 times under 2 conditions of 85°C and room temperature to maintain good conductivity. This shows that Ag@Cu conductive ink printed flexible electronic products are competitive.

查看原文本刊更多论文

Ag@Cu 水性纳米材料导电油墨在 3D 打印中的应用。

在印刷电子应用领域，铜（Cu）纳米粒子被认为是银（Ag）和金（Au）的理想替代品。由于铜具有更高的导电性，因此其成本明显低于银和金。为了研究电子印刷的适用性，我们采用逐步投料法将纳米银和纳米铜分散在乙醇和水中，制备了 Ag@Cu 导电油墨。该墨水具有无毒、低含量、低成本等优点。设计了一个三维（3D）模型，并利用挤出 3D 打印技术在相纸基底上打印了导电图案。讨论了水性树脂对导电图案附着力的影响。打印出的导电图案在经过 100 次弯曲后仍能保持稳定的导电性。导电图案具有良好的热稳定性。在 85°C 和室温两种条件下测试 10 次，仍能保持良好的导电性。这表明 Ag@Cu 导电油墨印刷柔性电子产品具有竞争力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)

CiteScore

6.00

自引率

6.50%

发文量

126

期刊介绍： 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.