Fabrication of Temperature- and Humidity-Independent Silver Nanoparticle's Carbon Composite-Based Strain Sensor Through Additive Manufacturing Process.

IF 2.3 4区 工程技术 Q3 ENGINEERING, MANUFACTURING
3D Printing and Additive Manufacturing Pub Date : 2023-08-01 Epub Date: 2023-08-09 DOI:10.1089/3dp.2021.0032
Iqbal Nadeem, Sajid Memoon, Rahman Khalid, Amin Qausaria Tahseen, Muhammad Shakeel, Ahmad Salman, Amin Mohsin
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Abstract

A highly sensitive low-cost strain sensor was fabricated in this research study based on microdispensing direct write (MDDW) technique. MDDW is an additive manufacturing approach that involves direct deposition of functional material to the substrate. The devices were printed directly onto a polymeric substrate by optimizing the fabrication parameters. A composite of silver and carbon was used as active sensor material where both materials in the composite have opposite resistance temperature coefficients. The ratio of materials in the composite was selected so that the effect of temperature on the resistance of overall composite was canceled out. This resulted in achieving temperature compensation or inherent independence of the strain sensor resistance on temperature without requiring any additional sensors and components. The sensor was further encapsulated by electrospray deposition, which is also an additive manufacturing approach, to eliminate the effect of humidity as well. Electrical and morphological characterizations were performed to investigate the output response of the sensors and their physical and structural properties. An analog signal conditioning circuit was developed for seamless interfacing of the sensor with any electronic system. The sensor had an excellent gauge factor of 45 and a strain sensitivity of 45 Ω/μɛ that is higher than most of the conventional strain sensors. The sensor's response showed excellent temperature and humidity compensation reducing the relative effect of temperature on the resistance by ∼99.5% and humidity by ∼99.8%.

通过增材制造工艺制作与温度和湿度无关的银纳米粒子碳复合材料应变传感器
本研究基于微点直接写入(MDDW)技术制造了一种高灵敏度、低成本的应变传感器。MDDW 是一种增材制造方法,涉及将功能材料直接沉积到基底上。通过优化制造参数,器件被直接打印在聚合物基底上。银和碳的复合材料被用作活性传感器材料,复合材料中的两种材料具有相反的电阻温度系数。选择复合材料的比例是为了抵消温度对整个复合材料电阻的影响。这就实现了温度补偿或应变传感器电阻对温度的固有独立性,而不需要任何额外的传感器和元件。通过电喷沉积(也是一种增材制造方法)对传感器进行了进一步封装,以消除湿度的影响。为了研究传感器的输出响应及其物理和结构特性,对其进行了电学和形态学表征。还开发了模拟信号调节电路,以便将传感器与任何电子系统无缝连接。传感器的测量系数为 45,应变灵敏度为 45 Ω/μɛ,高于大多数传统应变传感器。传感器的响应显示出出色的温度和湿度补偿能力,温度对电阻的相对影响降低了 ∼ 99.5%,湿度降低了 ∼ 99.8%。
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来源期刊
3D Printing and Additive Manufacturing
3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)
CiteScore
6.00
自引率
6.50%
发文量
126
期刊介绍: 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.
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