Medical Engineering & Physics

SCI期刊

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中科院SCI期刊分区 WOS期刊分区历年影响因子历年发表投稿信息同类期刊

中文名称：

医学工程与物理

期刊缩写：

Med. Eng. Phys.

影响因子：

1.7

ISSN：

print: 1350-4533
on-line: 1873-4030

研究领域：

工程技术-工程：生物医学

创刊年份：

1994年

h-index：

自引率：

4.50%

Gold OA文章占比：

19.03%

原创研究文献占比：

97.65%

SCI收录类型：

Science Citation Index Expanded (SCIE) || Scopus (CiteScore)

期刊主页：

http://www.journals.elsevier.com/medical-engineering-and-physics/

期刊介绍英文：

Medical Engineering & Physics provides a forum for the publication of the latest developments in biomedical engineering, and reflects the essential multidisciplinary nature of the subject. The journal publishes in-depth critical reviews, scientific papers and technical notes. Our focus encompasses the application of the basic principles of physics and engineering to the development of medical devices and technology, with the ultimate aim of producing improvements in the quality of health care.Topics covered include biomechanics, biomaterials, mechanobiology, rehabilitation engineering, biomedical signal processing and medical device development. Medical Engineering & Physics aims to keep both engineers and clinicians abreast of the latest applications of technology to health care.

CiteScore：

CiteScore	SJR	SNIP	CiteScore排名
4.3	0.458	0.830	学科排名百分位大类：Biochemistry, Genetics and Molecular Biology 小类：Biophysics 75 / 152 50% 大类：Engineering 小类：Biomedical Engineering 158 / 303 48%