2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Inline thermal transient testing of high power LED modules for solder joint quality control

Pub Date : 2011-06-20 DOI: 10.1109/ECTC.2011.5898733 G. Elger, R. Lauterbach, Kurt Dankwart, C. Zilkens

Cost-effective lithography for TSV-structures

Pub Date : 2011-06-20 DOI: 10.1109/ECTC.2011.5898696 U. Vogler, F. Windrich, A. Schenke, R. Volkel, Matthias Bottcher, Ralph Zoberbier

Synthesis of high quality, closely packed vertically aligned carbon nanotube array and a quantitative study of the influence of packing density on the collective thermal conductivity

Pub Date : 2011-06-20 DOI: 10.1109/ECTC.2011.5898669 W. Gu, Wei Lin, Yagang Yao, C. Wong