2014 15th International Conference on Electronic Packaging Technology

2014 15th International Conference on Electronic Packaging Technology
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2014 15th International Conference on Electronic Packaging Technology - 最新文献

Development and characterization of graphene-enhanced thermal conductive adhesives

Pub Date : 2016-09-01 DOI: 10.1109/ESTC.2016.7764682 M. Casa, Nan Wang, Shirong Huang, L. Ye, P. Ciambelli, Johan Liu

Rapid formation of Cu-Sn intermetallic compounds by strong electric current

Pub Date : 2014-10-16 DOI: 10.1109/ICEPT.2014.6922702 Baolei Liu, Yanhong Tian, Shang Wang, Rui Zhang, Xin Zhao, C. Dong, Chunqing Wang

Molecular modeling of the conductivity of carbon nanotubes under different temperature and humidity

Pub Date : 2014-10-16 DOI: 10.1109/ICEPT.2014.6922847 N. Yang, Xianping Chen, M. Cai, Daoguo Yang, Guoqi Zhang
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