2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International

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2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - 最新文献

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies

Pub Date : 2012-08-16 DOI: 10.1109/3DIC.2012.6262949 C. Ko, Z. Hsiao, Y. J. Chang, P. Chen, J. Huang, Hsin-Chia Fu, Y. J. Huang, C. Chiang, W. L. Tsat, Y. -. Chen, W. Lo, Kuan-Neng Chen

Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC

Pub Date : 2012-08-16 DOI: 10.1109/3DIC.2012.6263046 M. Aung, Eric Lim, T. Yoshikawa, T. T. Kim

Cu-based bonding technology for 3D integration applications

Pub Date : 2012-08-16 DOI: 10.1109/3DIC.2012.6262974 Kuan-Neng Chen, Z. Xu, F. Liu, C. Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Z. Hsiao, N. Klymko, Hsin-Chia Fu, Y. -. Chen, Jian-Qiang Lu, W. Lo

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