Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)

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Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - 最新文献

The limits of system improvement through liquid diagonal routing of interconnects

Pub Date : 2003-06-02 DOI: 10.1109/IITC.2003.1219761 J. Joyner, R. Venkatesan, J.A. Davis, J. Meindl

The application of ALD WN/sub x/C/sub y/ as a copper diffusion barrier

Pub Date : 2003-06-02 DOI: 10.1109/IITC.2003.1219734 S. Smith, G. Book, W. Li, Y. Sun, P. Gillespie, M. Tuominen, K. Pfeifer

Impact of metal deposition process upon reliability of dual-damascene copper interconnects

Pub Date : 2003-06-02 DOI: 10.1109/IITC.2003.1219701 K. Ishikawa, T. Iwasaki, T. Fujii, N. Nakajima, M. Miyauchi, T. Ohshima, J. Noguchi, H. Aoki, T. Saito

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