Creating Low Thermal Resistance Interfaces in Wide Bandgap Semiconductors Through Bonding

已完结 10 由 seraphsunkw 发布于 2025/11/18 16:43:44

DOI:10.1109/ICSJ52620.2021.9648886
作者：Zhe Cheng, M. Goorsky, F. Mu, Tadadomo Suga, S. Graham
文献类型：期刊论文
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Institute of Electrical and Electronics Engineers (IEEE)

Abstract：The thermal resistance at interfaces in wide bandgap semiconductors can impact the overall thermal resistance in junction temperature in devices. However, the resistance that exists at inter

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