Development of Bidirectional Pulsed Power Supply and Its Effect on Copper Plating of Printed Circuit Board Via-Filling

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DOI:10.1109/ICPEA56363.2022.10052559
作者：Shoutao Wang
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1109/ICPEA56363.2022.10052559

Institute of Electrical and Electronics Engineers (IEEE)

Abstract：A bidirectional pulse power supply with 0-20A continuous adjustable forward and 0-50A continuous adjustable reverse is designed using DSP (Digital Signal Processor), and the bidirectional pu

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