Development of Bidirectional Pulsed Power Supply and Its Effect on Copper Plating of Printed Circuit Board Via-Filling

2022 5th International Conference on Power and Energy Applications (ICPEA) Pub Date : 2022-11-18 DOI:10.1109/ICPEA56363.2022.10052559

Wenguang Chen, Shoutao Wang, Zhijian Liu, Caiyi Wei, Yuanyuan Peng

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Abstract

A bidirectional pulse power supply with 0-20A continuous adjustable forward and 0-50A continuous adjustable reverse is designed using DSP (Digital Signal Processor), and the bidirectional pulse power supply is used to test copper plating on printed circuit boards with filled via-holes. The effects of different frequencies, pulse width ratios of forward and reverse currents, and current densities on the copper plating were investigated by the single variable method, and were compared with DC (Direct Current) copper plating, respectively. The experimental results show that the bidirectional pulse power supply is a better effect and is faster than the DC power supply for via-filling copper plating, which can reduce the use of additives and is in line with the green development concept. The parameters of the pulse affect the plating to different degrees. In this solution system, the optimal parameters for bidirectional pulse plating are a frequency of 1 kHz, a forward pulse current density of 4 ASD (Ampere square decimeter, A/dm2) with a 50% duty cycle, and a reverse pulse current density of 16 ASD with 2.5% duty cycle.

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双向脉冲电源的研制及其对印制板充孔镀铜的影响

利用DSP (Digital Signal Processor)设计了一种0-20A正向连续可调、0-50A反向连续可调的双向脉冲电源，并将该双向脉冲电源用于对填充过孔印刷电路板的镀铜测试。采用单变量法研究了不同频率、正反电流脉宽比和电流密度对镀铜的影响，并分别与直流镀铜进行了比较。实验结果表明，双向脉冲电源对过孔镀铜效果更好，速度比直流电源快，可以减少添加剂的使用，符合绿色发展理念。脉冲参数对镀层有不同程度的影响。在该溶液体系中，双向脉冲镀的最佳参数为频率为1 kHz，正向脉冲电流密度为4 ASD(安培平方分米，a /dm2)，占空比为50%，反向脉冲电流密度为16 ASD，占空比为2.5%。

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2022 5th International Conference on Power and Energy Applications (ICPEA)

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