高可靠的基于inp的hbt,具有在高电流密度下工作的边缘结构

Yoshino K. Fukai, Kenji Kurishima, Minoru Ida, Shoji Yamahata, Takatomo Enoki
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引用次数: 15

摘要

对于正在开发的用于实现40 Gbit/s光通信系统的InP HBT,证实了边缘结构由于抑制表面复合电流的产生而提高器件寿命的有效性。该结构的加速寿命测试表明,电流增益逐渐减小模式的激活能为1.7 eV,在125°C下推断的器件寿命超过1×108小时,并且这种退化不取决于高达2 mA/µm2的工作电流密度。因此,实现了高电流密度下的高可靠性,从而实现了高速设计。分析了电流增益的衰减机理。发现可以通过增加发射极的层厚来控制突然退化,从而可以消除。以上结果证实了作者的InP HBT在实际实施中具有足够的可靠性。©2007 Wiley期刊公司电子工程学报,2009,29 (4):1104 - 1104;在线发表于Wiley InterScience (www.interscience.wiley.com)。DOI 10.1002 / ecjb.20320
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly reliable InP-based HBTs with a ledge structure operating at high current density

For the InP HBT being developed for 40 Gbit/s optical communication system realization, the effectiveness of the ledge structure for enhancement of device lifetime due to suppressing generation of the surface recombination current is confirmed. An accelerated life test for this structure shows that the activation energy of the mode in which the current gain decreases gradually is 1.7 eV, that the device life extrapolated at 125 °C is more than 1×108 hours, and that this degradation does not depend on the operating current density up to 2 mA/µm2. Thus, high reliability at a high current density allowing high-speed design is realized. Also, the degradation mechanism of the current gain is analyzed. It is found that sudden degradation can be controlled by increasing the layer thickness of the emitter and can consequently be eliminated. The above results confirm that the authors' InP HBT has sufficient reliability for practical implementation. © 2007 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 90(4): 1– 8, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.20320

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