脉冲CO2激光在硅中的吸收及其引起的激光烧蚀和表面损伤的形成

Tetsuo Sakka , Satoshi Akiba , Akira Kuroyanagi , Kokichi Hotta , Yukio H. Ogata , Mahito Mabuchi
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引用次数: 8

摘要

研究了不同掺杂浓度下TEA CO2激光器在硅晶片中的吸收影响规律。透过率随通量的增加而降低,掺杂浓度对透过率的影响较小。脉冲强度在通过样品后的时间分布显示出宽度的变窄。结果表明,光诱导吸光度在脉冲中间增加,导致脉冲后半部分的吸收,并且这种效应对硅样品的基态吸光度不敏感。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Absorption of pulsed CO2 laser in silicon and resulting laser ablation and surface damage formation

The fluence dependence of the absorption of TEA CO2 laser in silicon wafers at various dopant concentrations has been studied. The transmittance decreased with increasing fluence, and the effect of the dopant concentration was found to be small. The time profile of the pulse intensity after transmitting through a sample showed a narrowing of the width. The results indicate a buildup of photo-induced absorbance in the middle of a pulse, leading to the absorption of the later part of the pulse, and also suggest that this effect is insensitive to the ground state absorbance of the silicon samples.

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