用于应力强度因子无损评估的涡流传感器建模

Salaheddine Harzallah, Mohamed Chabaat
{"title":"用于应力强度因子无损评估的涡流传感器建模","authors":"Salaheddine Harzallah,&nbsp;Mohamed Chabaat","doi":"10.1016/j.aasri.2014.09.011","DOIUrl":null,"url":null,"abstract":"<div><p>In this paper, a nondestructive evaluation by sensor Eddy current is used as a tool to control cracks and microcracks in materials. A simulation by a numerical approach such as the finite element method is employed to detect cracks in materials and eventually to study their propagation using a crucial parameter such as a Stress Intensity Factor (SIF). This method has emerged as one of the most efficient techniques for prospectin cracks in materials, evaluating SIFs and analyzing crack's growth in the context of linear elastic fracture mechanics (LEFM). This technique uses extrapolation of displacements from results compared with those obtained by the integral interaction. On the other hand, crack'sgrowth is analyzed as a model by combining the maximum circumferential stress criteria with the critical plane for predicting the direction of crack growth. In this research, a constant crack growth increment is determined using the classical Paris's model, or the so-called modified Paris's model. It is also shown herein that stress intensity factors needed for these models are calculated using the domain form of the J-integral interactions.</p></div>","PeriodicalId":100008,"journal":{"name":"AASRI Procedia","volume":"9 ","pages":"Pages 57-63"},"PeriodicalIF":0.0000,"publicationDate":"2014-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.aasri.2014.09.011","citationCount":"3","resultStr":"{\"title\":\"Eddy Current Sensor Modeling for the Nondestructive Evaluation of Stress Intensity Factor\",\"authors\":\"Salaheddine Harzallah,&nbsp;Mohamed Chabaat\",\"doi\":\"10.1016/j.aasri.2014.09.011\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this paper, a nondestructive evaluation by sensor Eddy current is used as a tool to control cracks and microcracks in materials. A simulation by a numerical approach such as the finite element method is employed to detect cracks in materials and eventually to study their propagation using a crucial parameter such as a Stress Intensity Factor (SIF). This method has emerged as one of the most efficient techniques for prospectin cracks in materials, evaluating SIFs and analyzing crack's growth in the context of linear elastic fracture mechanics (LEFM). This technique uses extrapolation of displacements from results compared with those obtained by the integral interaction. On the other hand, crack'sgrowth is analyzed as a model by combining the maximum circumferential stress criteria with the critical plane for predicting the direction of crack growth. In this research, a constant crack growth increment is determined using the classical Paris's model, or the so-called modified Paris's model. It is also shown herein that stress intensity factors needed for these models are calculated using the domain form of the J-integral interactions.</p></div>\",\"PeriodicalId\":100008,\"journal\":{\"name\":\"AASRI Procedia\",\"volume\":\"9 \",\"pages\":\"Pages 57-63\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/j.aasri.2014.09.011\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"AASRI Procedia\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2212671614001115\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"AASRI Procedia","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2212671614001115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文将传感器涡流无损检测技术作为控制材料裂纹和微裂纹的工具。采用数值模拟方法(如有限元法)来检测材料中的裂纹,并最终使用应力强度因子(SIF)等关键参数来研究裂纹的扩展。在线弹性断裂力学(LEFM)的背景下,该方法已成为寻找材料裂纹、评估SIFs和分析裂纹扩展的最有效技术之一。这种技术利用与积分相互作用得到的结果相比较的位移外推法。另一方面,将最大周向应力准则与预测裂纹扩展方向的临界平面相结合,将裂纹扩展作为一个模型进行分析。在本研究中,采用经典的Paris’s模型或所谓的修正Paris’s模型确定一个恒定的裂纹扩展增量。本文还表明,这些模型所需的应力强度因子是使用j积分相互作用的域形式计算的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Eddy Current Sensor Modeling for the Nondestructive Evaluation of Stress Intensity Factor

In this paper, a nondestructive evaluation by sensor Eddy current is used as a tool to control cracks and microcracks in materials. A simulation by a numerical approach such as the finite element method is employed to detect cracks in materials and eventually to study their propagation using a crucial parameter such as a Stress Intensity Factor (SIF). This method has emerged as one of the most efficient techniques for prospectin cracks in materials, evaluating SIFs and analyzing crack's growth in the context of linear elastic fracture mechanics (LEFM). This technique uses extrapolation of displacements from results compared with those obtained by the integral interaction. On the other hand, crack'sgrowth is analyzed as a model by combining the maximum circumferential stress criteria with the critical plane for predicting the direction of crack growth. In this research, a constant crack growth increment is determined using the classical Paris's model, or the so-called modified Paris's model. It is also shown herein that stress intensity factors needed for these models are calculated using the domain form of the J-integral interactions.

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