{"title":"提高铜与聚四氟乙烯板附着力的工艺","authors":"A. Pérez, A. Torres, R. Torres","doi":"10.1155/2016/7419584","DOIUrl":null,"url":null,"abstract":"A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.","PeriodicalId":13278,"journal":{"name":"Indian Journal of Materials Science","volume":"21 4","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Process to Improve the Adherences of Copper to a PTFE Plate\",\"authors\":\"A. Pérez, A. Torres, R. Torres\",\"doi\":\"10.1155/2016/7419584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.\",\"PeriodicalId\":13278,\"journal\":{\"name\":\"Indian Journal of Materials Science\",\"volume\":\"21 4\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Indian Journal of Materials Science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1155/2016/7419584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Indian Journal of Materials Science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1155/2016/7419584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Process to Improve the Adherences of Copper to a PTFE Plate
A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.
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