热激活晶界解钉

M.J. Gore , M. Grujicic , G.B. Olson , M. Cohen
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引用次数: 36

摘要

采用热激活变形理论的概念,考虑了热激活对颗粒阵列与迁移晶界之间相互作用性质的影响。发现在小颗粒尺寸和高温下,热激活的边界解钉变得显着。对于给定的粒子阵列,这导致了一个与时间相关的平均晶粒尺寸,它比传统的“齐纳-格莱德曼”静态平衡模型的预测更粗糙。对于铁合金的晶粒尺寸和温度,在热激活干扰边界钉钉的有效性之前,可以实现晶粒细化分散体的粒径和体积分数的大幅降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermally activated grain boundary unpinning

The influence of thermal activation on the nature of the interactions between an array of particles and a migrating grain boundary is considered, adapting concepts from the theory of thermally activated deformation. Thermally activated unpinning of boundaries is found to become significant at small particle sizes and high temperatures. For a given particle array, this leads to a time dependent average grain size which is coarser than the predictions of the traditional “Zener-Gladman” static equilibrium model. For grain sizes and temperatures of interest in ferrous alloys, substantial reductions in particle size and volume fraction of grain refining dispersions can be achieved before thermal activation interferes with the effectiveness of boundary pinning.

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